Wyse Technology Appoints Former Dell and Sun Executive to Run Engineering

Thin-computing Leader also hires former Dell Sales Executive and former Deutsche Bank Financial Markets Expert

SAN JOSE, Calif. – 01/17/2006 - Wyse Technology, the worldwide leader in thin computing, announced today the appointment of three new executives. William Platt has joined the executive team as Senior Vice President of Worldwide Engineering; Gary Staunch is the new Vice President and General Manager of America’s Sales and Henry Fieglein has joined the marketing team as Vice President of Worldwide Financial Services Solutions.

Platt’s engineering leadership will play an instrumental role in developing and maintaining the company’s engineering research and development growth plans worldwide.

“We are delighted to welcome Bill to our executive team.  He brings a wealth of experience in engineering and international management expertise to Wyse,” said John Kish, CEO of Wyse Technology.  “As we continue our rapid expansion into China, India, Poland and other regions, Bill’s knowledge of manufacturing and development will be critical to the success of those operations.  His extensive experience in all facets of product engineering will be a major asset to the company.” 

Prior to joining Wyse, Platt was the Director of Services at Dell, where he delivered $3.5 billion in direct revenue. He also spent 14 years at Sun Microsystems where he held a number of positions including, Vice President of Operating Platforms Group, Vice President of Java Systems and Software Cycle, and Director of Customer Care Asia Pacific.  Platt has a B.S. in Economics from the Wharton School of Business and a B.S. in Systems Engineering from the University of Pennsylvania.

Staunch was most recently with Dell in the role of Area Vice President of Sales, Large Corporate Accounts. In this role Gary managed Regional Directors, Inside Sales Directors and the System Consultant Team, and was responsible for delivering $1 billion in revenue. Prior to Dell, Gary held senior sales positions with Compaq and IBM. Gary has a B.A. from the University of the Pacific in Stockton.

Fieglein has more than 17 years of financial marketing experience including his position as the CTO Global Director of Infrastructure and Security Architecture at Deutsche Bank, where he provided the analysis, design and guidance for the entire Deutsche Bank infrastructure. He attended Haverford College where he earned a B.S. in Mathematics and Computer Science.

Staunch and Fieglein will report to Tarkan Maner, Senior Vice President of Worldwide Sales and Marketing.

About Wyse Technology

Wyse Technology is the global leader in thin computing. Wyse and its partners deliver the hardware, infrastructure software, and services that comprise thin computing, allowing people to access the information they need using the applications they want, but with better security, manageability, and at a much lower total cost of ownership than a PC. Thin computing allows CIOs and senior IT professionals to reduce costs, manage risk, and deliver access to information. Wyse is headquartered in San Jose, California, with offices worldwide.

For more information, visit the Wyse website at http://www.wyse.com or call 1-800-GET-WYSE